1. The high-rise board adopts special materials such as high TG, high speed, high frequency, thick copper, thin dielectric layer, etc., which puts forward high requirements for inner layer circuit production and graphic size control, such as the integrity of impedance signal transmission, which increases the inner layer circuit production Difficulty. The line width and distance are small, the number of open and short circuits is increased, the number of shorts is increased, and the pass rate is low; the signal layer of fine lines is more, and the probability of AOI missed detection of the inner layer is increased; It is easy to roll the board when passing the machine; most of the high-rise boards are system boards, and the unit size is large, and the cost of scrapping the finished product is relatively high.

 

 

 

2.Lauffer laminator: Multiple inner core plates and prepregs are superimposed, which is easy to produce defects such as sliding plates, delamination, resin voids and air bubbles during lamination. When designing the laminated structure, it is necessary to fully consider the heat resistance, voltage resistance, amount of glue and media thickness of the material, and set a reasonable high-level board pressing program. The number of layers is large, and the expansion and contraction amount control and size coefficient compensation amount cannot maintain consistency; the interlayer insulation layer is thin, which easily leads to the failure of interlayer reliability test. After the thermal stress test, bursting delamination occurred.