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Xingsen Technology's semiconductor packaging project officially broke ground

Xingsen Technology's semiconductor packaging project officially broke ground

  • Categories:Company News
  • Author:
  • Origin:Xingsen Technology
  • Time of issue:2020-03-03 11:48

Xingsen Technology's semiconductor packaging project officially broke ground

  • Categories:Company News
  • Author:
  • Origin:Xingsen Technology
  • Time of issue:2020-03-03 11:48
  • Views:0
On February 28, the semiconductor packaging project jointly invested and established by the National Integrated Circuit Industry Fund, the Science City (Guangzhou) Investment Group and Xingsen Technology officially held a groundbreaking ceremony. It was also the "Top 100 Project Celebration" of the Guangzhou Development Zone and the High-tech Zone. 22 academicians such as Yuan Longping and Zhong Nanshan all praised through the online video, and have high hopes for future development. At the scene, Qiu Xingya, chairman and general manager of Xingsen Technology, Jiang Wujun, deputy general manager and general manager of the ICS manufacturing center, Chang Xu, deputy general manager of the ICS business, and members of the project core management team attended the ceremony.
 
It is understood that the investment in the semiconductor packaging substrate industry base project is 1.6 billion yuan. The integrated circuit packaging substrate with a planned production capacity of 30,000 square meters / month and 15,000 square meters / month of class carrier boards are the first national integrated circuit industry funds to land in Guangzhou. Items. The project will focus on the field of integrated circuit packaging materials, and is committed to solving the problem of "stuck neck" of China's semiconductor industry chain, enhancing independent innovation capabilities, and effectively making up for the shortcomings of China's semiconductor industry chain.
 
Semiconductor packaging substrates, also known as package carrier boards, are one of the most important raw materials for integrated circuit packaging. The main function is to carry the integrated circuit chip as a carrier, and connect the signal between the wafer and the printed circuit board (PCB) with the internal circuit of the packaging substrate. It can protect the circuit, fix the circuit and dissipate the residual heat. It is the most important raw material carrier board in the packaging process. The existing HDI (PCB) cannot meet the needs of electronic products to continue to be intelligent, miniaturized and functional. The diversified development trend and the new generation of hard boards developed by using the packaging substrate process are also the most suitable packaging carriers combined with SIP (System in a Package) system-level packaging technology.
 
Xingsen Technology hopes that through the construction of this project, it will continue to improve relevant R & D and innovation capabilities, and contribute to complementing and improving the shortcomings of China's semiconductor industry chain. In order to promote the continued high-speed development of China's semiconductor industry, the Pearl River Delta region will be built into an internationally influential semiconductor and integrated circuit industry gathering area to provide strong support for the high-quality development of the manufacturing industry.
 
According to the performance report, from January to December 2019, Xingsen Technology achieved operating income of 3.792 billion yuan, an increase of 9.19% year-on-year, and the average operating income growth rate of the semiconductor and component industry was 8.87%; the net profit attributable to shareholders of listed companies was 303 million Yuan, an increase of 41.09% year-on-year. Xingsen Technology said that sales revenue maintained steady growth, mainly from semiconductor test board business, IC packaging substrate business and SMT business revenue growth.
 
For the main reason for profit growth, Xingsen Technology said that first of all, the operating conditions of subsidiaries such as Harbor in the United States, Yixing Silicon Valley, and Exception in the United Kingdom have further improved; secondly, the income of the subsidiary Shanghai Zefeng has achieved substantial growth and profitability has increased; in addition, The cost reduction and efficiency improvement measures implemented by the company showed that the cost rate has decreased and the profitability has improved.
 
Source: Xingsen Technology, copyright belongs to the original author
 
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