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Xingsen Technology: Xingke Semiconductor expects to enter the production phase in the first half of the year

Xingsen Technology: Xingke Semiconductor expects to enter the production phase in the first half of the year

  • Categories:Industry News
  • Author:
  • Origin:Panorama Network
  • Time of issue:2020-04-16 08:53

Xingsen Technology: Xingke Semiconductor expects to enter the production phase in the first half of the year

  • Categories:Industry News
  • Author:
  • Origin:Panorama Network
  • Time of issue:2020-04-16 08:53
  • Views:0
At the online briefing session of Xingsen Technology's 2019 annual report, the company's deputy general manager and secretary of the board of directors Jiang Wei said that at this stage, the company's strategy is to focus on PCB and semiconductor business, and will not cross-border and blindly diversify. field.
 
This year is a critical period for the company's investment and expansion. The 10,000 square meter / month IC carrier capacity expanded in 2018 and the 123,600 square meter / year PCB capacity expanded for the convertible bond project will be released and put into production this year. The company and large funds, The joint venture company Guangzhou Xingke Semiconductor Co., Ltd. jointly established by Science City Group is in the pre-expansion infrastructure stage. The above expansion projects will lay a good foundation for the company to increase its production capacity and market share in the next few years.
 
The 400g optical module circuit board is the company's key R & D project, and its main application areas include 5G communication products and Internet data centers. At the research and development level, with high-speed signal transmission and high-density interconnection key technologies and applications as the research direction, the company makes full use of existing international advanced printed circuit board mass production technology and one-stop service technology for design, manufacturing, simulation testing , Overcome key technologies such as ultra-low-loss high-speed material processing technology, loss test technology, ultra-high flatness buried copper technology, gold finger ultra-high corrosion resistance technology, high-precision impedance control technology, and small pitch bonding plate manufacturing to achieve 400G high-speed high-density The independent intellectual property technology development of the optical module printed circuit board has helped the rapid development of China's 5G communication industry. In the future, the company will continue to invest in research and development to enhance its technical strength, and take advantage of the rapid development of China's 5G industry to enhance the company's industry position and operating performance.
 
Source: Panorama
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