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The launching ceremony of Anglimeiwei was held

The launching ceremony of Anglimeiwei was held

  • Categories:Industry News
  • Author:
  • Origin:Angeli
  • Time of issue:2020-04-22 11:17

The launching ceremony of Anglimeiwei was held

  • Categories:Industry News
  • Author:
  • Origin:Angeli
  • Time of issue:2020-04-22 11:17
  • Views:0
Source: Agilent
On April 18, 2020, Anglimeimeiwei and TTM Group completed the formal delivery of the acquisition of its mobile business sector. Due to the impact of the epidemic, the new company's sailing ceremony was held on April 20 in Xiamen, Guangzhou, Shanghai, and Hong Kong via video. The mobile business segment includes all the shares of four companies, Guangzhou Meiwei Electronics Co., Ltd., Shanghai Meiwei Electronics Co., Ltd., Shanghai Meiwei Technology Co., Ltd., and Shanghai Kesil Electronics Co., Ltd.
 
The merger and acquisition was initiated by Agilent Industries and Xiamen Semiconductor Investment Group and combined with outstanding teams and strategic partners in the industry. Among them, Agilent Industries is a leading Hong Kong listed flexible circuit board R & D, manufacturing and sales listing in Hong Kong Company; Xiamen Semiconductor Investment Group is a professional investment group focused on semiconductor industry investment and mergers and acquisitions. This strong merger and acquisition is conducive to the positioning of the long-term strategic development of both parties, and by integrating the advantageous resources of all parties, the high-end integrated circuit packaging carrier (Including rigid-flex combined carrier board) and SLP (Supplied Carrier Board) fields enhance the core competitiveness of China's integrated circuits and other industries, forming the largest domestic integrated circuit package carrier and SLP (leadership enterprise).
 
After the merger and acquisition, Anglimeiwei will be strategically committed to providing customers with complete high-density interconnection solutions in the fields of 5G communications, smart mobile terminals, automobiles, Internet of Things and medical electronics, mainly including rigid and flexible high-end HDI Board, carrier board, carrier-like board (SLP), rigid-flex combination board and its electronic module. Through this merger and acquisition, Agilent Levi will continue to invest in, strengthen R & D efforts, improve the ability to serve high-end customers, and establish the company's leading position under the changing industry pattern.
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