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Analysis of PCB layering problem

Analysis of PCB layering problem

  • Categories:VStar News
  • Author:
  • Origin:Sina News
  • Time of issue:2018-06-22 16:30

Analysis of PCB layering problem

  • Categories:VStar News
  • Author:
  • Origin:Sina News
  • Time of issue:2018-06-22 16:30
  • Views:0
Reasons and solutions for PCB board delamination frequently in use
 
the reason:
(1) Supplier material or process issues
(2) Poor design materials and poor copper distribution
(3) The storage time is too long, the storage period is exceeded, the PCB board is damp
(4) Improper packaging or storage, damp
 
Countermeasure: Choose the package and use constant temperature and humidity equipment for storage. Do the factory reliability test of the PCB, for example: the thermal stress test test in the PCB reliability test, the supplier is responsible for taking 5 or more times without delamination as the standard, and will be confirmed at the sample stage and each cycle of mass production And the general manufacturer may only request 2 times, and only confirm once every few months. The IR test of simulated placement can also prevent more defective products from flowing out, which is a must for excellent PCB manufacturers. In addition, the PCB board Tg should be selected above 145 ℃, so it is safer.
 
Reliability test equipment: constant temperature and humidity box, stress screening type thermal shock test box, PCB reliability test equipment
[Source]: Sina News
 
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