Copper Clad Laminate High Temperature Hot Press

German LAUFFER RMV200/10 copper clad laminate high temperature hot press is suitable for PCB substrate CCL. It has the functions of heating, constant temperature, cooling, boosting, constant pressure, reducing pressure and vacuum pumping, and can meet the lamination process requirements of copper clad laminate.
Learn more

IC package carrier plate laminating machine

Germany LAUFFER a new model tailored for the IC package carrier industry: IC package carrier laminator. LAUFFER Laminator with an experienced team and mature technology process enables it to provide innovative and complete IC package carrier lamination solutions. At the same time, it ensures the cost-effectiveness of the IC package carrier lamination process.
Learn more

Vacuum press

Vacuum laminator is suitable for pressing and forming of various materials. It belongs to non-standard design equipment. Tonnage and table size can be designed and manufactured according to the size of pressing products and pressing process parameters.
Learn more

PCB Laminating Machine

Product use: Mainly used in high-frequency materials, 5G\4G communication materials, high-temperature composite materials, powder metallurgy, printed circuit boards, IC packaging substrates and other industries.
Learn more

Vacuum Laminator

The RMV series vacuum laminator system can be used for the lamination of 5G high-frequency materials, composite materials, warm co-fired ceramics (LTCC), ceramics, copper foil resin fiberboard and PCB products.
Learn more

German LAUFFER laminating machine

German LAUFFER laminators can be applied to printed circuit boards (PCB), 5G high-frequency materials, copper clad laminates (CCL), substrates, etc. They can also be used to plastic press various certificate cards and for composite materials, low temperature co-fired ceramics (LTCC), ceramics and other fields.
Learn more
< 1 >