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PCB laminating machine
Product use: Mainly used in high frequency materials, 5G \ 4G communication materials, high temperature composite materials, powder metallurgy, printed circuit boards, IC packaging substrates and other industries
LAUFFER laminating machine can be designed and manufactured according to the customer's product requirements. We have a complete solution from laminating and pressing, and professionally provide the world-leading German company LAUFFER.
The frame body of the LAUFFER high-frequency material lamination system uses the pressure-resistant design of the tear-proof structure and the use of German high-strength steel plates, so that the press will not be deformed when it is operated at 400 ℃ high temperature, and the German fine grinding process guarantees flatness and The parallelism can reach a high accuracy of ± 0.015mm / m. The high-density gun-hole drum design of the heating plate makes the temperature accuracy within ± 1.5 ℃ (400 ℃ laminating system can be controlled within ± 2 ℃).
Press specifications
Press total pressure |
600T |
Closed stroke |
100% |
Hot plate width |
690mm |
Hot plate length |
1350mm |
Hot plate thickness |
60mm |
Opening height |
120mm |
Opening layer |
10 OPEN |
way to heat up |
Heat medium electric heating |
cooling method |
Water-cooled heat mediu |
Heating rate |
Average temperature rise 7 ℃ / min (adjustable) |
Average cooling rate |
~7 °C/min |
Maximum vacuum of cabin |
≤ 10 mbar |
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