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PCB laminating machine
PCB laminating machine
PCB laminating machine
Product use: Mainly used in high frequency materials, 5G \ 4G communication materials, high temperature composite materials, powder metallurgy, printed circuit boards, IC packaging substrates and other industries
LAUFFER laminating machine can be designed and manufactured according to the customer's product requirements. We have a complete solution from laminating and pressing, and professionally provide the world-leading German company LAUFFER.
 
The frame body of the LAUFFER high-frequency material lamination system uses the pressure-resistant design of the tear-proof structure and the use of German high-strength steel plates, so that the press will not be deformed when it is operated at 400 ℃ high temperature, and the German fine grinding process guarantees flatness and The parallelism can reach a high accuracy of ± 0.015mm / m. The high-density gun-hole drum design of the heating plate makes the temperature accuracy within ± 1.5 ℃ (400 ℃ laminating system can be controlled within ± 2 ℃).
 
Press specifications
 

Press total pressure

600T

Closed stroke

100%

Hot plate width

690mm

Hot plate length

1350mm

Hot plate thickness

60mm

Opening height

120mm

Opening layer

10 OPEN

way to heat up

Heat medium electric heating

cooling method

Water-cooled heat mediu

Heating rate

Average temperature rise 7 ℃ / min (adjustable)

Average cooling rate

~7 °C/min

Maximum vacuum of cabin

≤ 10 mbar

 

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