Coreless carrier plate distributor

It is suitable for 1L & 3L Coreless and ETS products made of IC carrier plates, and is an integrated production equipment that automatically separates and corrects plates production Core production structure and stores upper and lower plates separately. Improve the efficiency of plate removal operation, no contact in the whole process, and improve the plate breakage problem caused by manual plate removal and the serious plate Warpage problem caused by structural stress.
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Laminating machine for scientific research laboratory

It is suitable for the development of various new materials: composite materials, carbon fiber, glass fiber, ceramics, polymer materials, powder metal, printed circuit board, rubber, silicone resin, etc. It is mainly used in university laboratories, scientific research units and factory laboratories to evaluate and develop products and customer projects, as well as to test the quality of various material samples.
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Copper Clad Laminate High Temperature Hot Press

German LAUFFER RMV200/10 copper clad laminate high temperature hot press is suitable for PCB substrate CCL. It has the functions of heating, constant temperature, cooling, boosting, constant pressure, reducing pressure and vacuum pumping, and can meet the lamination process requirements of copper clad laminate.
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IC package carrier plate laminating machine

Germany LAUFFER a new model tailored for the IC package carrier industry: IC package carrier laminator. LAUFFER Laminator with an experienced team and mature technology process enables it to provide innovative and complete IC package carrier lamination solutions. At the same time, it ensures the cost-effectiveness of the IC package carrier lamination process.
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High temperature press 380 ℃ ~ 650 ℃

The LAUFFER high-temperature press has high temperature and high heating rate, and is suitable for various types of pressing materials such as 5G product materials, high-frequency materials, PTFE materials, composite materials, and carbon fiber materials.
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