PCB Laminate Problems and Solutions Experience-LAUFFER Press

2017-11-20 16:25

LAUFFER Press is here to list some of the most commonly encountered PCB laminate problems and how to identify them. Once you encounter PCB laminate problems, you should consider updating to the PCB laminate specification.

 

1, to have a reasonable direction:

 

Such as input/output, AC/DC, strong/weak signal, high frequency/low frequency, high voltage/low voltage, etc., their direction should be linear (or separated), not to blend with each other. Its purpose is to prevent mutual interference. The best direction is in a straight line, but it is generally not easy to achieve. The most unfavorable direction is circular. Fortunately, isolation can be set to bring improvement. For DC, small signal, low voltage PCB design requirements can be lower. "Reasonable" is relative.

 

2. Choose a good pick-up place:

 

Small grounding point I do not know how many engineers and technicians have done on it how much discussion, shows its importance. In general, it is required to have a common ground, for example, multiple ground wires of the forward amplifier should be merged and then connected to the main ground, etc. In reality, it is difficult to do it completely due to various restrictions, but we should try our best to follow it. This problem is quite flexible in practice. Everyone has their own set of solutions. It is easy to understand if it can be explained for a specific circuit board.

 

3. Reasonable arrangement of power filter/decoupling capacitor:

 

In general, only a number of power supply filter/decoupling capacitors are drawn in the schematic diagram, but it is not indicated where they should be connected. In fact, these capacitors are set for switching devices (gate circuits) or other components that need filtering/decoupling. These capacitors should be arranged as close as possible to these components, and if they are too far away, they will have no effect. Interestingly, when the power supply filter/decoupling capacitors are properly arranged, the problem of grounding points is not so obvious.

 

4. The lines are exquisite:

 

Conditions to do wide line never do thin; High-voltage and high-frequency lines should be smooth, no sharp chamfers, and no right angles should be used for corners. Ground wire should be as wide as possible, it is best to use a large area of copper, this docking site problem has been greatly improved.

 

Although some problems occur in the post-production, but it is brought about in the PCB design, they are: too many wire holes, copper process a little careless will bury hidden dangers. Therefore, the design should be as far as possible to reduce the line hole. The density of parallel lines in the same direction is too large, and it is easy to connect into one piece when welding. Therefore, the line density should be determined depending on the level of the welding process. The distance of the welding spot is too small, which is not conducive to manual welding, and the welding quality can only be solved by reducing the work efficiency. Otherwise, it will leave hidden dangers. Therefore, the determination of the minimum distance of the solder joint should take into account the quality and efficiency of the welding personnel. The pad or wire hole size is too small, or the pad size does not match the hole size. The former is unfavorable for manual drilling, and the latter is unfavorable for CNC drilling. It is easy to drill the pad into a "c" shape, and if it is heavy, drill off the pad. The wire is too thin, and the large area of the unwired area is not covered with copper, which is easy to cause uneven corrosion. That is, when the unwired area is corroded, the thin wire is likely to be over-corroded, or broken, or completely broken. Therefore, the role of setting copper is not only to increase the ground area and anti-interference. (LAUFFER press)

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