Lauffer vacuum laminator: What is an IC carrier plate?

2021-01-31 19:57

Lauffer vacuum laminator introduces to you what is IC carrier board. IC carrier board is also called package substrate. It is a key special basic material used in advanced packaging. It plays the role of providing electrical conduction between IC chip and conventional PCB, and at the same time provides protection, support, heat dissipation and formation of standardized installation size for chip. There are many ways to classify packaging substrates, which can be classified mainly by packaging process, material properties and application fields.

IC carrier board is developed from HDI, and the technical barrier is much higher than HDI and ordinary PCB. IC carrier board is developed on the basis of HDI board, there is a certain correlation between the two, but the technical threshold of IC carrier board is much higher than HDI and ordinary PCB. The IC carrier board can be understood as a high-end PCB, which has the characteristics of high density, high precision, high number of feet, high performance, miniaturization and thinness. It has higher requirements on various technical parameters, especially the most core line width/line distance parameter. Take the chip packaging substrate of the mobile product processor as an example, its line width/line spacing is 20μm/20μm, and will continue to decrease to 15μm /15μm and 10μm /10μm in the next 2-3 years, while the general PCB line width/line spacing should be above 50μm/50μm.

Compared with ordinary PCB, IC carrier board has many technical difficulties. These technical difficulties are the biggest industry access threshold for IC carrier board. The following summarizes some technical difficulties of IC carrier board.

1) core plate production technology. The core board of the IC carrier board is very thin and easily deformed. Only when the board expansion and contraction, lamination parameters and other process technologies have made breakthroughs can the warping and lamination thickness of the ultra-thin core board be effectively controlled.

2) Microporous technology. The pore size is generally about 30μm, which is much smaller than that of ordinary PCB and HDI, and the number of stacked pore layers reaches 3, 4 and 5 orders.

Previous Page

Customs code for vacuum press

Lauffer laminator: application of ceramic substrate

Next Page

Previous Page

Customs code for vacuum press

Next Page

Lauffer laminator: application of ceramic substrate

More news

Jiangsu Shengyi High Frequency Communication Substrate Project Foundation Laying Ceremony Held

Jiangsu Shengyi High Frequency Communication Substrate Project Foundation Laying Ceremony Held

On the morning of December 17, 2017, the groundbreaking ceremony of Jiangsu Shengyi Special Materials Co., Ltd., invested by Guangdong Shengyi Technology Co., Ltd., was held in Nantong Tongzhou National High-tech Development Zone, which is known as "the first state of Tongjiang and Dahai. Liu Shufeng, chairman of Guangdong Shengyi Technology Co., Ltd., Chen Renxi, general manager, Wu Xiaolian, chief operating officer, Zeng Xutang, chairman of Shaanxi Shengyi Technology Co., Ltd., Yang Hui, general manager, Jiao Feng, general manager of Suzhou Shengyi Technology Co., Ltd., Wang Hui, general manager of Changshu Shengyi Technology Co., Ltd., and representatives of the design, supervision, cost and construction units responsible for project construction attended the ceremony.

2024/03/01

LAUFFER high-frequency board press: high-frequency high-speed substrates will usher in high-speed growth in the 5G era.

LAUFFER high-frequency board press: high-frequency high-speed substrates will usher in high-speed growth in the 5G era.

LAUFFER high-frequency board press collects relevant information of 5G high-frequency and high-speed substrates for you on the Internet.

2024/03/01

Jiangxi Jiujiang PCB Project Formed a Complete Industrial Chain

Jiangxi Jiujiang PCB Project Formed a Complete Industrial Chain

In 2017, Jiangxi Jiujiang Economic Development Zone always regarded investment promotion as the "lifeline" of accelerating development, further innovated the investment promotion system and mechanism, changed the investment promotion thinking, adhered to the "two-wheel drive" to promote development, focused on industrial introduction projects, and achieved a detonating effect New breakthroughs in the recruitment of emerging industries. In the whole year, 73 new industrial projects were signed, with a total investment of 63 billion billion yuan, and the proportion of strategic emerging industry projects increased by 37%. In the electronic circuit materials industry, the development zone mainly focuses on Taiwan-funded Dehong fine yarn and the world's second-largest Shengyi copper clad laminate project, resulting in investment in 3 billion yuan Dehong glass fiber yarn and electronic cloth project,

2024/03/01