真空压合机的操作规范

2021-03-09 11:12

The following 8-layer PCB circuit board pressing process as an example, introducedvacuum pressThe operation process and specification.

According to the specification parameters of the means of production.vacuum pressEnter the correct program, plate length, plate width and plate number; Check whether the temperature, oil pressure, cold pressing pressure and time settings are correct; After confirming the temperature of the hot plate of the vacuum press, send the steel plate to be pressed into the vacuum press. After hot pressing rises, check the pressure setting value, actual pressure value, temperature setting value, actual temperature value, vacuum setting value and actual value; When the PCB vacuum press is powered on, the upper and lower heating plates of the machine begin to heat up, and the vacuum system starts to work at the same time, so that the space in the working area is close to the vacuum state, and all the air between the pressing material and the material is guaranteed to be discharged. When the temperature of the PCB vacuum laminating machine reaches the melting temperature of the semi-solidified sheet, the semi-solidified sheet will melt and closely adhere to the copper foil. The subsequent process is the process of heat preservation and cooling, which makes the prepreg and copper foil become one, fully meet the requirements of PCB and eliminate the stress in the middle of the material. After the hot pressing is complete, the hot plate is automatically lowered, and the steel plate is taken out and sent to the cold press to start cold pressing; after the cold pressing is complete, the pressing operation is completed after the pressure plate is automatically lowered. If you want to make a multilayer board, you can do the inner layer board according to the above requirements, plus semi-cured sheet, copper foil can be completed, in which the role of semi-cured sheet is to play the role of insulation and reinforcement.

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