The total investment of Shennan Circuit Project is 6 billion yuan.

2021-07-15 10:35

Recently, Shennan Circuit participated in the centralized commencement of major projects in Guangdong Province in the second quarter of 2021, and settled in Guangzhou Development Zone, Huangpu District, together with six other major integrated circuit industry projects, to celebrate the centenary of the founding of the party with the practical action of concentrated construction. Lai Weixuan, Chairman and General Manager of AVIC International, and the main leaders of Shennan Circuit attended the start-up activities and introduced the Guangzhou project planning to Ma Xingrui, Governor of Guangdong Province. Ma Xingrui praised and affirmed Shennan Circuit's courage to explore new industrial highlands and actively assume the responsibility of national semiconductor packaging substrate localization breakthrough.

It is reported that Shennan Circuit will invest 6 billion yuan to build a new highland for packaging substrates. This project will improve the domestic FCBGA packaging substrate industry ecology. The overall production capacity of the project is expected to be about 0.2 billion FC-BGA, 3 million panel RF/FC-CSP and other organic packaging substrates.

It is understood that FCBGA packaging substrate is the core device of CPU/GPU/FPGA except wafer. It has high technical requirements, long supply cycle and great difficulty in purchase. The completion of this project will realize the breakthrough of "zero" domestic batch supply of FCBGA packaging substrate and play a positive role in promoting the agglomeration and development of integrated circuit industry in Huangpu District of Guangzhou City.

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