How to improve laminated copper foil wrinkling by PCB laminating machine

2023-03-03 15:02

Today, I would like to discuss with you the problem of copper foil wrinkling when PCB laminator is hot pressed and laminated to PCB boards. When PCB laminator is hot pressed, the resin undergoes a change process of "solid state-high elastic state-viscous flow state-high elastic state-solid state". In the viscous flow state with a material temperature of about 80-140, the resin flows to fill the inner layer gap. PCB board in hot pressing "local undervoltage" is the main reason for wrinkling, the response measures are mainly from the elimination of "local undervoltage" direction. The methods include reducing pressure loss, increasing the pressure distributed in the underpressure zone, reasonably suppressing pressure to improve the pressure efficiency, and using thicker copper foil with stronger strength.

The heating rate of the material temperature of the PCB laminator is about 1.5 ℃/min, and the normal lamination parameters are high pressure when the outer layer temperature is 86-90 ℃. In addition to the previous plate arrangement measures, the test starts to apply high pressure at the outer material temperature of 80 ℃ and the inner material temperature of 55 ℃. The poor lamination wrinkling was reduced to 13.6%. When feeding, take the feeding plate and the inner scrap plate for test. The production condition is that on the basis of the original measures, the high pressure pressure on the actual board surface is increased from 26kgf to 30kgf, and the yield after lamination is increased to 100.

 

The staggered arrangement of plates can reduce the mutual influence between the upper and lower laminations, and is simple to operate, will not increase the cost and affect the production capacity. It can not only adapt to the improvement of copper foil wrinkling, but also be suitable for the lamination of all products. Adding steel plates and reducing lamination will affect the production capacity, but these two methods not only have obvious effects but also have high reliability. Even if the ideal effect is not achieved, they will not produce other adverse consequences, therefore, it is worth using in the control of copper foil wrinkling. The PCB laminator has the best control effect on wrinkling by pressing and pressing in advance. However, attention must be paid to other hidden dangers such as excessive glue flow, uneven board thickness and so on caused by pressing in advance. Attention should also be paid to the matching of pressure and temperature (pressing timing and heating rate). For different materials, equipment and different product designs, it takes many experiments to confirm the best combination.

There are many measures in the wrinkling improvement scheme of laminated copper foil of PCB laminator, such as optimizing design, balancing plate arrangement and improving lamination parameters. The two measures are summarized as "increasing the pressure distributed to the local underpressure area of the plate and improving the pressure efficiency".

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