Shenzhen V-STAR Industry & Trade Co.,LTD.--Professional Supplier of LAUFFER Lamination System
Brief Introduction of Pressing Process of PCB Laminator
2023-03-28 17:26
Multilayer board press plate is a process in which PCB laminator uses high temperature and high pressure to heat and cure the prepreg to etch one or more inner layers to form a board (treated by black oxide) and copper foil to form a multilayer board. The process of bonding each layer of the circuit board into a whole includes kiss pressing, full pressing and cold pressing. In the kiss-press stage, the resin penetrates into the bonding surface and fills the voids in the wire, and then enters full press to bond all voids. The so-called cold pressing is to quickly cool the circuit board and maintain dimensional stability.
PCB lamination is a means of bonding each layer of circuit sheet into a whole with the help of B- Stage prepreg. This bonding is achieved through the mutual diffusion, penetration and cross-linking of large molecules at the interface. The whole process includes three stages: kiss pressure, full pressure and cold pressure. In the kissing stage, the resin in the B- Stage preprepreg melts into a low-viscosity resin, infiltrates all bonding surfaces and fills in line voids, expel bubbles and gradually increase the dynamic viscosity of the resin. After entering the high pressure, the exhaust is completely completed, and the gap is filled and evenly distributed until the curing and crosslinking reaction of the resin is complete. Cold pressing is to keep the multi-layer board dimensionally stable during rapid cooling.
The laminate material, together with the press plate, is loaded from the stack of workpieces into a large multi-layer laminator. In each pressing layer, several multi-layer circuit boards PCB can be pressed. A typical laminating machine can press about 80 boards. Each is 36 x 72 inches in area and 1/16 inch thick. The laminator uses a press that generates a pressure of more than 1000 psi. The heat source uses steam. When pressurized, it transfers heat to each laminate. This is to cure the material into a uniform sheet. In order to ensure that the material in the middle of each layer of the multi-layer circuit board pcb gets enough heat to achieve final curing, several thermocouples are embedded in the middle of the pressure plate to map the temperature curve.
At the same time, we need to pay attention to three issues when laminating: temperature, pressure and time. The temperature mainly refers to the melting temperature and curing temperature of the resin, the set temperature of the hot plate, the actual temperature of the material and the change of the heating rate. These parameters require attention. As for pressure, the basic principle is to fill the interlayer cavity with resin and exhaust interlayer gas and volatiles. The time parameters are mainly controlled by pressing time, heating time and gel time. A timer automatically records time according to a predetermined curing cycle, and when the corrected time is over, cooling water flows through the platen to terminate the curing cycle. After fully cured, the laminate was trimmed to remove the untidy resin exudate from the peripheral edges. Because of the different thermal expansion coefficients of the materials, some multi-layer PCB manufacturers have found that it is best to put the pressed laminate into a heated oven. This allows the material to be relieved of stress due to lamination.
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