The demand for ABF carrier plates is expected to grow in the long term.

2023-08-01 17:06

The latest report from Goldman Sachs Securities pointed out that the demand for long-term ABF carrier boards driven by artificial intelligence (AI) servers continues to grow. With the increase of AI server and computing performance requirements, related chips mainly use 2.5D and 3D packages, and use higher-order ABF carrier boards in the IC back-end production process to speed up the upgrade of ABF carrier boards, resulting in more complex design of ABF carrier boards and driving the growth of ABF carrier board market scale from 2023 to 2025.

 

Market participants pointed out that ABF carrier board as the AI chip sealing end of the necessary materials, is expected to benefit from the growth of computing power demand. In the future, with the growth of demand for high-performance computing chips such as CPU, GPU, FPGA, ASIC and the wide application of Chiplet technology, the demand for ABF carrier boards will further increase.

 

There are many types of IC substrates, which can be divided into three categories. These classifications include encapsulation/encapsulation type, bonding technique, and material properties/characteristics. In addition, we can divide them into application areas.

Package Type: Each package may require a different kind of substrate.

BGA substrate: This type of substrate is suitable for IC packaging with large pin count (>300). In essence, we can attribute it to its excellent electrical performance and heat dissipation performance.

Chip scale package IC substrate: This kind of substrate is miniaturized and thinned. Therefore, it is suitable for a small single chip package (CSP) with a small pin count.

Flip-Chip IC Substrates: This type of substrate is best suited for controlled collapse chip connections in a flip-chip scale package (FCCSP). Therefore, it has good heat dissipation protection to prevent circuit loss and signal interference.

Multi-chip module IC substrate: The substrate in this type of package houses multiple ICs. Each IC may have a different function. Therefore, the substrate must be lightweight. However, due to the characteristics of MCM ICs, this substrate may not have sound signal interference, good wiring, or good heat dissipation.

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