Xingsen Technology promotes FCBGA package substrate project

2023-08-11 16:17

On August 2, Xingsen Technology issued an announcement that in order to promote the construction of the FCBGA packaging substrate project, it plans to increase the capital of the holding subsidiary Guangzhou Xingsen Semiconductor Co., Ltd. (hereinafter referred to as "Guangzhou Xingsen") and introduce the China Development Bank Manufacturing Transformation and Upgrade Fund (Limited Partnership) (hereinafter referred to as "China Development Bank Manufacturing Fund") and other 5 strategic investors, the total amount of the proposed capital increase is 1.605 billion yuan. After the completion of the capital increase, Xingsen Technology's direct shareholding in Guangzhou Xingsen decreased to 47.85 per cent, and after overlaying the 4.53 per cent indirect shareholding through Zhuhai Juli, Zhuhai Juxian and Zhuhai Juzhi, the cumulative shareholding ratio was 52.38 per cent, still owning a controlling stake in Guangzhou Xingsen. As the main implementation body of Xingsen Technology in Guangzhou FCBGA packaging substrate, Guangzhou Xingsen was established in March 2022. According to the plan, it will invest about 6 billion yuan to build a production and research and development base in Guangzhou. The project will be constructed in two phases. The first phase is expected to reach production in 2025, with a production capacity of 10 million pieces/month and a full production value of 2.8 billion yuan. The second phase is expected to reach production by the end of 2027, with a capacity of 10 million pieces/month and a full production value of 2.8 billion yuan; the total production capacity of the two phases is 20 million pieces/month, and the full production value is 5.6 billion yuan. In September 2022, the aforementioned projects have been capped, and the construction of the production line is expected to be completed in the fourth quarter of 2023 and trial production will begin.

(Source: Securities Times)

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