Analysis of Warpage and Distortion of PCB in Laminator Production

2017-11-20 16:19

Phenomenon signs:The substrate is warped or distorted, whether before, after or during processing. Post-soldering hole tilt is also a sign of substrate warpage and distortion.

Inspection method:With the float welding test, it is possible to carry out incoming inspection. The solder test with a 45 degree tilt is particularly effective.

Possible causes:

1. Warping or twisting of the material at the time of receipt or after sawing and cutting, usually caused by improper lamination, improper cutting or uneven laminate structure.

2. Warpage can also be caused by improper storage of materials, especially paper-based laminates, which are bowed or deformed when placed upright.

3. Warpage is caused by the unequal copper wall and iron wall foil, such as 1 ounce on one side and 2 ounces on the other side: the plating layer is not equal, or the special printed board design causes copper stress or thermal stress.

4 when soldering fixture or solid improper, heavy components in the soldering operation will also cause warping.

5. In the process of technological processing or soldering, the hole displacement or tilt on the material is caused by improper curing of the laminate or the stress of the substrate glass cloth structure.

Solution:

1. Straighten the material or release the stress in the oven, and cut the plate at the angle of inclination and the heating temperature recommended by the laminate manufacturer. Contact the manufacturer of the laminate to ensure that no substrate with uneven structure is used.

2. Store the material flat in a cardboard box or lay the material on the shelf. Usually the material should be placed at an angle of 60 degrees or less to the ground.

3. Contact the laminate manufacturer to avoid unequal copper foil on both sides. Analyze plating and stress, or local stress caused by heavy components or large copper foil area. The printed board was redesigned to balance the components and copper area. Sometimes most of the wires on one side of the printed board and the wires on the other side are arranged vertically, so that the thermal expansion of the two sides is not equal and causes distortion. Whenever possible, this kind of wiring should be avoided.

4. In the soldering operation, the printed board, especially the paper-based printed board must be clamped with a clamp. In some cases, heavy elements must be equalized with special clamps or with fixtures.

5. Contact the laminate manufacturer for any recommended post-cure measures. In some cases, the laminate manufacturer may recommend another laminate for use in a more stringent or specialized application.

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