HDI plate processing of vacuum hot press

2021-05-14 11:54

At present, the high density of printed boards has become the norm, with the design characteristics of high-precision circuit board products thin layer, fine lines, small blind hole diameter, small blind hole ring width, the production yield to improve the new requirements. High Density Interconnect (HDI) is a printed circuit board fabrication technology widely used in computer, communications, consumer electronics and other fields. In order to adapt to the development of various electronic products to high performance, multi-function, light and thin, and high reliability, high-density interconnection (HDI) printed circuit board technology is facing higher requirements.

Now Xiaobian to introduce HDI board how to use vacuum hot press press processing points:
Because the HDI board is very thin, it is very easy to produce deformation in the process of pressing, such as single angle, single area and other local deformation. When the inner layer pattern is deformed, the position of the inner layer disc and the like has changed, and the subsequent laser alignment cannot guarantee a good acceptance, resulting in a large deviation of the overall alignment. The uniformity of the pressing vacuum hot press and the design of the pressing program parameters have a great influence on the alignment, so to ensure the uniformity of the vacuum hot press and test the best pressing program is the key to ensure the alignment.

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