The Problem of Uneven Plate Thickness of Vacuum Hot Press

2021-04-29 09:50

The vacuum hot press has the problem of uneven board thickness when pressing the circuit board. This problem is fatal and will cause the product to be scrapped. Today, I 'd like to introduce some solutions to avoid detours. We must first consider reducing the pressure of the vacuum hot press to reduce the flow of glue, and try to keep more resin, because the resin affects ε r, the resin is stored more, ε r will be lower. Controls the lamination thickness tolerance. Because the PCB board thickness is not uniform, it indicates that the medium thickness changes, will affect Z0. In addition, we must strictly according to the PCB board type required by the customer, the type is wrong, ε r is wrong, the board thickness is wrong, the PCB manufacturing process is all right, and the same is scrapped. Because Z0 is greatly affected by ε r, the finished multilayer board should try to avoid water absorption, because the ε r = 75 of water will bring great decrease and instability effect to Z0. PCB board soldering will reduce the Z0 value of the signal line by 1 ~ 3Ω, in theory, the thickness of soldering should not be too thick, in fact, the impact is not great. The surface of the copper wire is in contact with air (εr = 1), so the measured Z0 value is higher. However, the Z0 value measured after solder resist will drop by 1 ~ 3Ω, because the εr of solder resist is 4.0, which is much higher than that of air.

It is very important for the inner layer of the circuit board to be pressed by a vacuum hot press. Please pay attention to it and find out the gap and protrusion of the conductor. For 2GHZ high-speed signal, even the gap of 0.05mm must be scrapped. The key is to control the line width and defects of the inner layer.

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