Optimization of Lamination Process by Lauffer Press

2021-12-09 10:20

Lauffer press to optimize the lamination process and reduce the occurrence of pink ring phenomenon: pink ring refers to the phenomenon that the oxide film on the copper surface of the hole ring has changed color or has been removed due to chemical reaction through the junction of the hole wall and the inner copper ring, exposing the natural color (pink) of copper.

With the increase of the number of printed board layers, the possibility of peeling off the junction of the inner copper foil and the hole increases; with the decrease of the aperture, the difficulty of cleaning the hole increases, and the possibility of penetration corrosion of chemical substances along the junction of the hole wall layers also increases. Therefore, the more layers, the smaller the hole, the more prone to pink circle phenomenon.

 

Pink rings are often found in the later stage of printed circuit board production, and their effects are as follows: ① reducing the bonding force between multilayer boards; ② The solution penetrates along the direction of glass fiber, which reduces the insulation resistance between pads that are close together and leads to short circuit in serious cases; ③ As the contact area of copper ring becomes smaller, small defects, such as plating bubbles and voids, usually allowed by hole metallization, may lead to increased resistance of the hole line, or even open circuit.

 

In the production process of printed circuit board, the inner layer surface treatment, lamination, curing, drilling, concave etching, chemical copper deposition, copper plating and other processes may lead to the production of pink circles. Printed board in the production process, to withstand the vertical mechanical impact force and the level of chemical etching force, so the layer must have sufficient bonding force, in order to resist the harm of these two effects. Therefore, the key to the production of pink circles lies in whether the blackening layer is firmly combined with the substrate, and the strength of the blackening layer's corrosion resistance. The following two points are the solution to solve the pink circle.

1) Improve the binding force of the blackening layer and the substrate

The surface of the copper is blackened to generate a layer of oxide (black copper oxide or red cuprous oxide or a mixture of the two) to further increase the specific surface and improve the bonding between the copper foil and the substrate. The blackening process parameters are optimized, and the combination ability of the blackening layer and the substrate is related to the blackening process, the crystal structure of the oxide, the thickness of the oxide layer and other factors.

2) Improve the corrosion resistance of the blackened layer

The corrosion resistance of the blackened layer is improved by reducing the thickness of the oxide layer. A layer of oxide film can be removed mechanically or chemically reduced. Chemical methods of alternative reducing agents are: formaldehyde/sodium hydroxide, sodium perphosphate, sodium borohydride and so on. After the blackening layer is reduced, not only the peel strength but also the acid etching resistance is enhanced.

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