Design Suggestions for PCB Pressing Structure of Lauffer Laminating Machine
2022-01-21 10:13
The main purpose of PCB lamination is to make PP combine different inner core boards and outer copper foils through "heat and pressure", and use the outer copper foil as the base of the outer circuit. However, different PP compositions with different inner layers and copper can be used to prepare circuit boards with different specifications and thicknesses. The lamination process is the most important process for PCB multilayer board manufacturing, and the basic quality indicators of various PCBs must be achieved after lamination.

For the pressing structure design of PCB board, the Lauffer laminator has collected the following suggestions on the network:
1. give priority to the thickness of the larger thin core (dimensional stability is relatively good)
2. Priority should be given to PP with low cost (for the same glass cloth type PP, the resin content basically does not affect the price)
3. It is preferred to use a symmetrical structure to avoid PCB warping after the finished product. The following figure is not called the structure and is not recommended.
4. Dielectric layer thickness "inner layer copper foil thickness x 2
It is forbidden to use PP with low resin content in single sheet for 5.1-2 layers and n-1 layers/n layers, such as 7628 × 1(n is the number of layers)
6. For 3 or more prepreg sheets arranged together or the thickness of the dielectric layer is greater than 25mil, PP is used in the middle except for the outermost layer and the innermost layer.
7. When the second and n-1 layers are 2oz bottom copper and the thickness of 1-2 layers and n-1/N layers of insulating layer is "14mil, it is forbidden to use single PP, and the outermost layer needs PP with high resin content, such as 2116 and 1080; If the residual copper rate is less than 80%, try to avoid using single 1080PP
8. When one sheet of PP is used for 1-2 layers and 1-n-1 layers/N layers of copper 1oz in the inner layer, the PP shall be of high resin content, except 7628 × 1
9. It is forbidden to use single PP for boards with inner copper ≥ 3oz. Generally, 7628 is not needed. Multiple PP with high resin content, such as 106, 1080, 2116......
10. For multilayer boards containing copper-free areas greater than 3 "× 3" or 1 "× 5", PP is generally not used for single core boards.
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