Shenzhen V-STAR Industry & Trade Co.,LTD.--Professional Supplier of LAUFFER Lamination System
Brief Introduction of PCB Vacuum Laminating Machine
2022-02-23 16:31
The vacuum laminating machine for pressing PCB board comprises a frame (1), a pressing chamber (2) is arranged in the frame (1) of the vacuum laminating machine, an electric heating device (3) and a hot pressing plate (4) are arranged in the pressing chamber (2) of the vacuum laminating machine, and the electric heating device (3) and the hot pressing plate (4) of the vacuum laminating machine are electrically connected; the hot pressing plate (4) of the vacuum press is provided with a plurality of heat conducting holes.
The copper foil substrate of the PCB is first cut into a size suitable for processing and production. Before laminating the substrate, it is usually necessary to roughen the copper foil on the surface of the substrate by brushing, micro-etching and other methods, and then attach the dry film photoresist to it at an appropriate temperature and with appropriate force. The substrate attached with the dry film photoresist is sent to an ultraviolet exposure machine for exposure. The photoresist will produce polymerization reaction after being irradiated by ultraviolet rays in the light-transmitting area of the negative (the dry film in this area will be retained as an etching resist in the later development and copper etching steps), and the circuit image on the negative will be transferred to the dry film photoresist on the plate surface. After removing the Baohu adhesive film on the film surface, remove the wet shadow of the non-illuminated area on the film surface with sodium carbonate aqueous solution, and then remove the exposed copper foil by etching with hydrochloric acid and hydrogen peroxide mixed solution to form a circuit. Finally, the dry film photoresist that has successfully retired is washed away with sodium hydroxide aqueous solution. For the inner circuit board with more than six layers (including), the riveting reference hole of the interlayer circuit alignment shall be punched out by the automatic positioning punching machine.
Multilayer PCBAs are fabricated in individual layers, either as thin etched plates or as trace layers, and then bonded with lamination. In this standard process, the inner layer is heated intensively and pressure is applied to it prior to high temperature curing. As the PCB slowly cools, the pressure is released before the circuit is laminated with a photosensitive dry resist.
PTFE microwave laminates are commonly used for RF circuit boards with high-speed signal flow. Characteristics such as minimal electrical losses, tight depth tolerances, and reliable dielectric constants make it an ideal PCBA for applications involving radio frequencies. When a PCB has two or more subsets, sequential lamination is a popular method. After creating a subset of multi-layer PCBs in a separate process, insulating materials are used between each pair, and then a standard PCB lamination process is implemented. It should be noted that this approach adds time and cost to the build process. Sequential lamination is a fundamental technique in the manufacture of multilayer circuit boards. The term describes how to build a PCBA in a multilayer structure by using copper sub-composites and insulating laminates. It allows complex tasks such as etching paths on the inner copper layer or drilling holes in buried vias. Without this technology, the increasingly common use of high-density interconnect (HDI) PCBAs in electronic products would not be possible.
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