Semiconductor Packaging Technology: IC Boards

2022-04-28 11:43

IC carrier board is a technology developed with the continuous progress of semiconductor packaging technology. In the mid-1990s, a new type of IC high-density packaging represented by ball grid array packaging and chip size packaging came out. IC carrier board came into being as a new packaging carrier.

IC carrier board is developed on the basis of HDI board. As a high-end PCB board, it has the characteristics of high density, high precision, miniaturization and thinning.

IC carrier board is also called packaging substrate. In the field of high-end packaging, IC carrier board has replaced the traditional lead frame and become an indispensable part of chip packaging. It not only provides support, heat dissipation and protection for the chip, but also provides electronic connection between the chip and PCB motherboard, playing the role of "connecting the preceding and the following". It can even be embedded in passive and active devices to realize certain system functions.

IC carrier board products are roughly divided into five categories, namely, memory chip IC carrier board, micro-electromechanical system IC carrier board, RF module IC carrier board, processor chip IC carrier board and high-speed communication IC carrier board, etc., mainly used in mobile intelligent terminals, services/storage and so on.

According to different packaging processes, IC carrier boards can be divided into wire bonding IC carrier boards and flip-chip IC carrier boards. Among them, wire bonding (WB) uses thin metal wires, using heat, pressure, ultrasonic energy to make the metal leads and chip pads, substrate pads tightly soldered, to achieve electrical interconnection between chips and substrates and information exchange between chips, a large number of applications in RF modules, memory chips, micro-electromechanical system device packaging;

Flip-chip (FC) packaging is different from wire bonding. It uses solder balls to connect the chip and the substrate, that is, solder balls are formed on the pads of the chip, and then the chip is turned over and pasted on the corresponding substrate, and the chip is combined with the substrate pad by heating and melting the solder balls. The packaging process has been widely used in product packaging such as CPU, GPU and Chipset.

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