Precautions for pressing of vacuum laminator

2022-05-17 15:49

Vacuum laminator press (lamination) is the process of bonding each layer of the circuit board into a whole. The whole process includes kiss pressure, full pressure and cold pressure. In the kiss-press stage, the resin penetrates into the bonding surface and fills the voids in the wire, and then enters full press to bond all voids. The so-called cold pressing is to quickly cool the circuit board and maintain dimensional stability.

Matters needing attention in the lamination process of vacuum laminator. First of all, in the design, the inner core board that must meet the lamination requirements, mainly the thickness, external dimensions, positioning holes, etc., needs to be designed according to specific requirements. Generally speaking, the inner core board requires no opening, short, open circuit, no oxidation and no residual film.

Secondly, when the multilayer board is laminated, it is necessary to treat the core board. The treatment process includes black oxidation treatment and browning treatment. The oxidation treatment is to form a black oxide film on the inner copper foil, and the browning treatment is to form an organic film on the inner copper foil.

 

Finally, when laminating, we need to pay attention to three issues: temperature, pressure and time. The temperature mainly refers to the melting temperature and curing temperature of the resin, the set temperature of the hot plate, the actual temperature of the material and the change of the heating rate. These parameters require attention. As for pressure, the basic principle is to fill the interlayer cavity with resin and exhaust interlayer gas and volatiles. The time parameters are mainly controlled by pressing time, heating time and gel time.

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