Shennan Circuit: Guangzhou packaging substrate project has carried out basic engineering construction.

2022-05-26 16:20

Shennan Circuit responded to investors' inquiries on the investor interaction platform about "What is the main manufacturing of the Guangzhou packaging substrate production base project? When can it bring performance to the company", said that the company's Guangzhou packaging substrate project is mainly for FC-BGA, FC-CSP and RF packaging substrate products. At present, the project is in normal progress, and the land use right has been obtained and the infrastructure construction has been carried out.

 

According to data, Shennan Circuit was established in 1984 and has always focused on the field of electronic interconnection. After more than 30 years of deep cultivation and development, it has three businesses: printed circuit boards, electronic assembly links, and packaging substrates. The company has become a leading enterprise in China's printed circuit board industry, a pioneer in China's packaging substrate field, and a characteristic enterprise of electronic assembly. At present, the company has become the world's leading wireless base station RF power amplifier PCB supplier, the leading domestic processor chip packaging substrate supplier, electronic assembly manufacturing characteristics of the enterprise.

It is understood that in order to seize the opportunity of industrial development and further enhance the competitiveness of the company, Shennan Circuit has invested in the construction of packaging substrate factories in Guangzhou and Wuxi. Among them, Guangzhou packaging substrate project plans to invest 6 billion yuan, mainly for FC-BGA, RF and FC-CSP packaging substrates, Wuxi high-end flip chip IC carrier product manufacturing project plans to invest 2.016 billion yuan, mainly for high-end storage and FC-CSP packaging substrates, is expected to be connected and put into production in the fourth quarter of 2022.

 

Looking forward to 2022, Shennan Circuit said that in the packaging substrate business, the company will continue to maintain its leading edge in market segments, seize the growth opportunities of various target markets, and increase the development and deep cultivation of domestic and foreign customers in the storage and FC-CSP fields. At the same time, we will step up the construction of new factories in Wuxi and Guangzhou and the process of subsequent capacity climbing, accelerate the development of FC-BGA product technology, and incubate in depth on the basis of the existing platform.

 

Regarding PCB business, Shennan Circuit said that it will continue to ensure the leading market share of communications and further expand overseas markets. Strengthen the development and introduction of new customers in data centers and automotive electronics, and at the same time do a good job in deep cultivation of existing customers to seize the opportunities for rapid development of the industry; Actively grasp the supply of raw materials and appropriately increase the reserve of key raw materials; Continue to consolidate quality control capabilities, strengthen cost control, and improve operating efficiency.


Source: Set microgrid

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