Bomin Electronics and Hefei Municipal Government Signed Strategic Cooperation Agreement on IC Packaging Board Industry Base Project

2022-05-26 16:26

In order to respond to market demand and build a first-class IC packaging board industry base in the industry, Bomin Electronics and Hefei Municipal Government recently held a "IC packaging board industry base project signing ceremony" at Qianhai Headquarters. The main leaders of the two sides attending the event include: Yuan Fei, member of the Standing Committee of Hefei Municipal Committee, Wu Wenli, director of Hefei Investment Promotion Bureau, Zhang Lu, deputy director of Hefei Economic Development Zone Administrative Committee and director of Comprehensive Protection Zone Administration Bureau; xu Huan, Chairman of Bomin Electronics, Liu Remote, Vice President of the Group, Xie Ci, Vice President of the Group, Yang Su, Director of Human Resources Administration of the Group, and Li Ming, Director of Hefei Office.

The total investment of this project is about 6 billion yuan, covering an area of about 200 mu. The project is divided into two phases, the first phase with a total investment of 3 billion yuan and the second phase with a total investment of 3 billion yuan (the above investment amount is only the preliminary estimated amount, and the actual investment agreement signed shall prevail).
Mainly engaged in the production of high-end high-density packaging board products, applications include memory chips, micro-electromechanical system chips, high-speed communication market and Mini LED. Among them, the first phase is planned to start construction in 2022 and the second phase is planned to start construction in 2025. After the first phase of the project is fully completed, it is expected to achieve annual sales of 3.1 billion yuan, annual tax revenue of 0.175 billion yuan, and 3000 new jobs. With the miniaturization, thinness and high functionality of semiconductor packages for electronic products such as smart phones, higher and higher requirements are put forward for high density, arbitrary layer structure, package area and high reliability of IC package carriers, which promotes the development of SiP, PoP, CoC, WLP and other ternary packages and advanced packages. To this end, Bomin Electronics will continue to increase R & D investment in packaging substrate materials and carrier board processing technology, accelerate technological innovation, strive to make a solid contribution to solving the "stuck neck" problem in the domestic electronics industry, and create a global multi-category PCB industry structure.

Source: Bomin Today

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