Agilent Meiwei "high-end packaging substrate and high-end HDI project" started.

2022-09-07 17:31

On the morning of September 6, the 22nd CIFIT Xiamen City major projects focused on the opening and completion of activities held. 30 major projects with a total investment of 62.4 billion yuan have been completed in all districts of the city. City leaders Cui Yonghui, Huang Wenhui, Yang Guohao, Wei Keliang and others participated in the start-up activities of Agilent Meiwei high-end packaging substrate and high-end HDI production capacity construction project in Haicang District.

Agilent Meiwei (Agilent Meiwei Electronics (Xiamen) Co., Ltd.) high-end packaging substrate and high-end HDI production capacity construction project is located in Haicang District Integrated Circuit Manufacturing Industrial Park, with a total investment of 7.38 billion yuan. It will build an integrated circuit packaging substrate manufacturing base integrating research and development, manufacturing, sales and service. Its products are used in 5G communication, intelligent mobile terminals, automobiles, Internet of Things, medical electronics and other fields. The project is divided into two phases of construction, the first phase is expected to complete the introduction of new products and formal production in 2024.

 

Source: HNPCA

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