Difficulties in PCB Pressing and Fabrication of Vacuum Laminator

2022-12-09 10:40

As a manufacturer of vacuum laminator, it is found that multiple inner core boards and prepreg sheets should be superimposed in PCB lamination process, and defects such as sliding plate, delamination, resin cavity and bubble residue are easy to occur during lamination production. When designing the laminated structure, it is necessary to fully consider the heat resistance, voltage resistance, filling amount and medium thickness of the material, and set a reasonable high-rise plate pressing program. The number of layers is large, the amount of expansion control and size coefficient compensation can not maintain consistency, the interlayer insulation layer is thin, easy to lead to inter-layer reliability test failure problem.

If the PCB board is found after pressing, the measurement standard of layer deviation is:

Layer bias is the difference in concentricity between the vias between the layers of the PCB that is supposed to be in place. The scope of control is determined according to the design requirements of different PCB types. The smaller the via, the more precise the control. In order to ensure the ability of conduction and overcurrent. In general, it should not exceed 1/4 of the diameter of the via hole.

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