The specific process of PCB vacuum laminating machine

2023-05-24 09:31

PCB vacuum lamination is the process of bonding each layer of the circuit board into a whole. The whole process includes kiss pressure, full pressure and cold pressure. In the kiss-press stage, the resin penetrates into the bonding surface and fills the voids in the wire, and then enters full press to bond all voids. The so-called cold pressing is to quickly cool the circuit board and maintain dimensional stability. The following is an example of a PCB laminator with a pressure of 800 tons and a vacuum laminator configured with two hot presses and one cold press. The lamination mode process of using programmed temperature rise and rotating pressure until high pressure is as follows:

1. Before lamination, check whether the rubber edge of the furnace door is normal;

2. When entering the furnace, check whether the temperature is 155~165 ℃

3. According to the lamination parameters specified in the process, the pressure is adjusted by analogy program;

4. When the pressure plate into the furnace, vacuum to 60~70mmHg, according to the process requirements for hot pressing, the whole process takes about 140 minutes

5. Transfer the hot-pressed plate to the cold press, and adjust the pressure to 160kg/cm2 for cold pressing operation, which takes 80 minutes.

6. Considering the cold pressing time, the best time between the platens of the two hot presses is 90 minutes.

7. The entire lamination process, the need for automatic drawing temperature curve instrument, in addition to the need to record the relevant pressure plate data, easy to track the quality.

Special attention should be paid to PCB lamination: the PCB lamination of copper-based core board is different from that of conventional four-layer board and multi-layer board. If the traditional lamination structure is used for lamination, the PP glue content and lamination parameters are extremely high, and it is easy to cause insufficient glue flow in the insulation area of the core board frame, lamination bubbles and other undesirable phenomena, resulting in poor quality scrapping and increasing production cost. At present, the industry has introduced the resin plug hole process to improve, that is, the resin is inserted into the core plate hole/groove by silk screen printing, after high temperature curing, the resin and the base copper are drawn for many times, and then pressed together. However, the production process of this process increases, the production efficiency is low, and the production cost increases. Therefore, when producing copper-based core boards, we must set the process parameters and then laminate them.

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