Factors of PCB Warpage Formation Caused by Vacuum Laminator

2023-06-08 16:16

Today, we focus on the reasons for the mixed pressure warpage of PCB high frequency PTFE sheet: the global PCB scale and technology are constantly updated, and the design of high frequency mixed pressure step printed circuit board has been driven by this trend. High-frequency mixed plate design, from an economic point of view, mixed plate design does achieve a substantial reduction in costs, from a technical point of view, due to the differences in the physical properties of different plates, material structure asymmetry, PCB manufacturers process production brings greater challenges.

Warping refers to the deformation of a part of a plate from its plane, usually measured by bowing and twisting. Warpage is a product defect of common concern in laminate factory, copper clad laminate factory and printed circuit board factory. For printed circuit boards made of different materials mixed pressure, due to the different thermal expansion coefficients of various PCB raw materials, it is difficult to completely eliminate warpage in the processing process, and only the warpage can be controlled as much as possible within a reasonable acceptance range.

 

The base material copper clad laminate of PCB is mainly composed of copper foil, base material and adhesive. The manufacturing process goes through a process of low temperature-high temperature-cooling and cooling. In this process, due to the great difference in thermal expansion and contraction of the three major materials, and the different longitudinal and transverse curing shrinkage rates of glass fiber cloth, it is bound to lead to warping and deformation due to the large internal stress accumulated in the finished board. Compared with the vacuum laminator, the main factors causing CB warpage are the temperature, pressure and heating rate of the pressure chamber when the press is working. In addition, the flatness of the pressure chamber and the parallelism under the pressure condition should be considered. This is because the long-term use of the pressure cavity or mold deformation, resulting in surface convex and concave, parallel degree of deterioration, resulting in uneven pressure distribution, easy to make the laminate in the accumulated stress warping.

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The specific process of PCB vacuum laminating machine

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