Common Problems in the Pressing Process of Copper Clad Laminator

2023-06-14 15:08

In the production and manufacturing process of copper clad laminate, the laminator presses and bonds the prepreg (pp sheet) under heating and pressure vacuum, and the molten resin glue will overflow to the mirror steel plate of the precision mold, the back of the copper foil, etc. After bonding and curing, it is easy to cause many factors that are not conducive to efficient production, such as failure of the plate dismantling process and difficulty in cleaning the precision mold. In the process of heating and pressing, when the temperature is higher than the glass transition temperature point (tg) of the resin, the resin melts with the increase of temperature, flows to the four sides and overflows under the action of pressure. If the flow of the resin is not effectively controlled, the resin will flow out of the effective area of the copper clad laminate and flow to the back of the mirror steel plate and copper foil of the precision mold. After bonding, it is easy to cause the failure of the disassembling process, the difficulty of cleaning the precision mold and many other factors that are not conducive to efficient production. At the same time, the thickness of the copper clad laminate is uneven and the edge becomes thinner due to the overflow of glue. The existing manufacturing method of copper clad laminate includes controlling the glue flow of the plate by controlling different lamination processes such as heating rate and pressure. The pressure device of the laminator includes an upper pressure plate and a lower support plate, and the upper pressure plate can move up and down relative to the lower support plate. A copper clad plate and a mirror copper plate are arranged between the upper pressure plate and the lower support plate, and an infrared sensor is arranged at the upper edge of the lower support plate, the semi-cured sheet on the surface of the copper clad laminate overflows, so that through the control of the process and the laminating machine equipment, the problem of overflowing glue has been improved to a certain extent.

In addition, it should be noted that the pressure and temperature in the pressing process of copper clad laminate should be appropriate. Pressing temperature is too high, will destroy the interface of chemical bonds, resulting in thermal decomposition reaction. Low pressing temperature and low pressure will cause poor curing and crosslinking, which will affect the solder resistance of the board. When pressing, it should also be noted that the temperature in the middle and surrounding of the hot plate of the press should be basically the same. In the summer humid climate conditions, with a good billet, not timely pressing, will also cause the edge of the material moisture absorption, affecting the resistance to dip welding.

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