How to improve the inner lamination of PCB board by vacuum laminating machine

2021-04-20 16:34

In the process of producing PCB with vacuum laminating machine, the semi-cured sheet (Pp sheet) is an essential raw material for the laminating process. Due to the inner layer design reason, the semi-cured sheet (Pp sheet) often has too much resin flow glue when laminating, resulting in thin dielectric layer of the produced PCB board and partial glue shortage delamination, especially the copper foil is easy to wrinkle at the golden finger part of the plug board, causing the product to be scrapped, in order to effectively solve this kind of scrap, improve the pass rate of products, need a kind of can reduce the phenomenon of pressure confluence glue, to improve the scrap caused by the lack of glue, improve the quality rate, save manufacturing costs.

So how to improve the copper plate structure of PCB inner layer lamination and lack of glue in the production of vacuum laminating machine, and solve the technical problems such as thin PCB interlayer, partial lack of glue and delamination, easy wrinkling of copper foil caused by excessive glue flow in the existing lamination process?

A copper plate structure to improve the inner layer of the PCB board, including the copper skin on the edge of each plate of the PCB inner layer thin substrate, between the copper skin of the plate edge and the molding line, in the avoidance of each tool hole and the four sides of the plate of the alignment module is provided with a flow groove. Wherein, a copper layer is laid on the forming gong empty area of the PCB inner layer thin substrate. To improve the copper plate structure of PCB inner layer lamination and glue shortage, through the arrangement of copper sheet, copper strip glue flow groove and copper layer, the glue flow amount of prepreg can be effectively reduced during lamination, and the occurrence of defects or scrap such as glue shortage, copper foil wrinkle and thin dielectric layer during PCB lamination can be prevented, the qualified rate of products can be effectively improved, the product scrap caused by glue flow can be avoided, and the primary qualified rate of products can be improved, the defect rate is reduced, and the production cost of the PCB board is saved. The setting of the glue flow groove can ensure the uniform fluidity of the resin during the pressing process, and the setting of the copper layer on the empty area of the forming gong can reduce the amount of glue filling and ensure the overall uniformity of the plate thickness. The setting of the copper plate structure of the utility model has a simple overall structure and is easy for mass production of the production line.

The distance between the copper strip and the plate edge is 0.5mm, the distance between the copper strip and the forming line is 0.5mm, the size of the copper strip is 20mm long * 1.5mm wide, and the distance between the copper strip and the copper strip is 1mm. There are 8 flowing glue grooves on the plate edge avoiding each tool hole and alignment module, and 2 flowing glue grooves are arranged on each plate edge. The width of the opened flowing glue groove is 5mm, the flowing glue groove close to the plate angle is 100~120mm from the plate angle, the spacing between the two flowing glue grooves is determined according to the specific product, and the length of the flowing glue groove is determined according to the plate edge distance of the specific product. By changing the honeycomb copper laying (large amount of glue flowing) of the original plate edge design, the plate edge is designed according to all copper laying, reducing the amount of glue flowing, and normally designing each functional module of the plate edge; At the gold finger plate with plug, additional copper strips need to be added between the copper sheet of the plate edge and the forming line, and the length of the copper strips can be designed according to the length of the gold finger. Avoid all tool holes and the alignment modules on the four sides of the plate, ensure the fluidity of the resin during the pressing process, and at the same time increase the copper laying in the empty area of the forming gong in the plate to form a copper layer, reduce the amount of glue filling, and ensure the overall uniformity of the plate thickness.

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