Shenzhen V-STAR Industry & Trade Co.,LTD.--Professional Supplier of LAUFFER Lamination System
HDI Pressing of Vacuum Laminator
2021-11-09 16:05
In recent years, the production efficiency of HDI circuit boards has been improved more and more, and the phenomenon of full load working of vacuum laminators has become more and more common. Since the hot plate temperature of the vacuum laminator is conducted from the outer layer plate to the inner layer plate, the increase in the number of laminated layers of the laminating press or the increase in the thickness of the HDI plate will highlight the difference in the actual material temperature of the inner layer plate and the outer layer plate. However, the large difference in actual material temperature will lead to obvious temperature difference (6 ℃-12 ℃ difference) and large difference in heating speed when HDI inner laminate and outer laminate are transferred to high pressure. Finally, it cannot guarantee that the inner laminate and outer laminate in the same lamination press have the same lamination state, which will bring great influence on the quality stability of batch plates, for example, the inconsistent curing conditions of PCB products lead to unstable reliability, and the inconsistent stress of the inner and outer plates after the pressing plate leads to different warping degrees of the plate surface. Germany's Lauffer vacuum laminator laminated DHI circuit board first need to consider the symmetry. Because the board will be affected by pressure and temperature during the lamination process, there will be stress in the board after the lamination is completed. Therefore, if the two sides of the laminated board are not uniform, the stress on both sides is different, causing the board to bend to one side, which greatly affects the performance of the PCB.
Because the thickness of the insulating layer of HDI is relatively thin. So the pressure plate is more difficult. Because of the same thickness, the strength of LDP is much better than that of RCC, and the flow speed is also slower, so it is easier to control. Where there is a blind buried hole in the inner layer, the line is more likely to open due to depression. Therefore, if there is a blind buried hole in the inner layer, the line design of the outer layer should avoid the blind buried hole position of the inner layer as much as possible. At least the line should not pass through the middle of the hole of the blind buried hole.
In addition, if there are too many buried holes between the second layer to the penultimate layer when pressing the plate, the thickness of the upper dielectric layer will be thinner than the thickness of the lower dielectric layer due to the creation of a channel during pressing. So in the circuit design to minimize the number of such holes.
It should also be noted that even in the same plane, if the copper distribution is uneven, the resin flow speed at each point will be different, so that the thickness of the copper cloth will be slightly thinner, and the thickness of the copper cloth will be slightly thicker. In order to avoid these problems, the uniformity of copper cloth, the symmetry of lamination, the design arrangement of blind buried holes and other factors must be examined in detail.
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