Relationship between PCB Lamination Quality Problem and Copper Clad Laminate

2024-01-12 10:00

The quality problems of PCB lamination are mostly caused by the supplier's raw materials or different lamination loads. Only a few customers can have corresponding data records, so that the corresponding load values and batches of materials can be distinguished during production. So there will be such a scene, PCB board production attached to the corresponding components, in the welding time of serious warping phenomenon, so the follow-up will produce a lot of costs. Therefore, if the quality control stability and continuity of PCB lamination can be predicted in advance, many losses can be avoided. When we encounter the problem of PCB lamination, the first thing we should consider is to incorporate this problem into the PCB process specification. When we enrich our technical specifications step by step, quality changes will occur when we reach a certain amount.

 

Here are some questions about the raw material copper clad laminate.

Surface problems of PCB copper clad laminate: poor adhesion of copper structure, adhesion of coating, some parts cannot be etched or some parts cannot be tin coated. The method of visual inspection can be used to form water lines on the water surface for visual inspection. The reason is that the laminate manufacturer did not remove the release agent, and the copper foil had pinholes above, resulting in resin loss and accumulation on the surface of the copper layer. An excess of antioxidant is coated on the surface of the copper layer. Improper operation, a large amount of dirt grease on the board surface. Therefore, contact the producer of the laminate to inspect the unqualified copper layer on the surface. It is recommended to use hydrochloric acid, and then use the method of machine brush to remove the foreign matter on the surface. Personnel in all processes must wear gloves and must be treated to remove oil stains before and after lamination.

Previous Page

Maintenance and maintenance method of vacuum laminating machine

Laboratory Laminator Temperature Control Failure Reason

Next Page

Previous Page

Maintenance and maintenance method of vacuum laminating machine

Next Page

Laboratory Laminator Temperature Control Failure Reason

More news

Jiangsu Shengyi High Frequency Communication Substrate Project Foundation Laying Ceremony Held

Jiangsu Shengyi High Frequency Communication Substrate Project Foundation Laying Ceremony Held

On the morning of December 17, 2017, the groundbreaking ceremony of Jiangsu Shengyi Special Materials Co., Ltd., invested by Guangdong Shengyi Technology Co., Ltd., was held in Nantong Tongzhou National High-tech Development Zone, which is known as "the first state of Tongjiang and Dahai. Liu Shufeng, chairman of Guangdong Shengyi Technology Co., Ltd., Chen Renxi, general manager, Wu Xiaolian, chief operating officer, Zeng Xutang, chairman of Shaanxi Shengyi Technology Co., Ltd., Yang Hui, general manager, Jiao Feng, general manager of Suzhou Shengyi Technology Co., Ltd., Wang Hui, general manager of Changshu Shengyi Technology Co., Ltd., and representatives of the design, supervision, cost and construction units responsible for project construction attended the ceremony.

2024/03/01

LAUFFER high-frequency board press: high-frequency high-speed substrates will usher in high-speed growth in the 5G era.

LAUFFER high-frequency board press: high-frequency high-speed substrates will usher in high-speed growth in the 5G era.

LAUFFER high-frequency board press collects relevant information of 5G high-frequency and high-speed substrates for you on the Internet.

2024/03/01

Jiangxi Jiujiang PCB Project Formed a Complete Industrial Chain

Jiangxi Jiujiang PCB Project Formed a Complete Industrial Chain

In 2017, Jiangxi Jiujiang Economic Development Zone always regarded investment promotion as the "lifeline" of accelerating development, further innovated the investment promotion system and mechanism, changed the investment promotion thinking, adhered to the "two-wheel drive" to promote development, focused on industrial introduction projects, and achieved a detonating effect New breakthroughs in the recruitment of emerging industries. In the whole year, 73 new industrial projects were signed, with a total investment of 63 billion billion yuan, and the proportion of strategic emerging industry projects increased by 37%. In the electronic circuit materials industry, the development zone mainly focuses on Taiwan-funded Dehong fine yarn and the world's second-largest Shengyi copper clad laminate project, resulting in investment in 3 billion yuan Dehong glass fiber yarn and electronic cloth project,

2024/03/01