NEWS
Lauffer laminator welcomes new students

Lauffer laminator welcomes new students

Lauffer Laminator welcome new students to the team! We are delighted to welcome eight new apprentices and two new students to work in Lauffer Pressen this month.

2017/12/20

LAUFFER: German LAUFFER PRESSEN Company History

LAUFFER: German LAUFFER PRESSEN Company History

Germany LAUFFER PRESSEN company course, here to introduce you to the LAUFFER press more than one hundred years of growth.

2017/12/19

Calibration method for LAUFFER laminator

Calibration method for LAUFFER laminator

This paper introduces the correction method of LAUFFER laminating machine, LAUFFER the structure, use, installation and after-sales service of laminating machine and the latest market price of LAUFFER laminating machine.

2017/12/19

Lauffer and China Ministry of Public Security Research Institute to establish a new ID card project card fitting equipment cooperation

Lauffer and China Ministry of Public Security Research Institute to establish a new ID card project card fitting equipment cooperation

Maschinenfabrik Lauffer GmbH & Co. KG is proud to announce the establishment of a new ID card project in the People's Republic of China with a card fitting equipment contract.

2017/12/19

Development of a new generation of automatic lamination system Lauffer GmbH & Co. KG(Lauffer Pressen)

Development of a new generation of automatic lamination system Lauffer GmbH & Co. KG(Lauffer Pressen)

Development of a new generation of automatic lamination system Lauffer GmbH & Co. KG(Lauffer Pressen)

2017/12/19

Lauffer certified to DIN EN ISO 9001:2015

Lauffer certified to DIN EN ISO 9001:2015

This month, Lauffer was again certified sucessfully according to ISO 9001:2015

2017/12/19

PCB Laminate Problems and Solutions Experience-LAUFFER Press

PCB Laminate Problems and Solutions Experience-LAUFFER Press

LAUFFER Press is here to list some of the most commonly encountered PCB laminate problems and how to identify them. Once you encounter PCB laminate problems, you should consider updating to the PCB laminate specification.

2017/11/20

Analysis of the impact of pressing materials, structures and graphics on plate deformation

Analysis of the impact of pressing materials, structures and graphics on plate deformation

The PCB board is formed by pressing the core board, the prepreg and the outer copper foil, wherein the core board and the copper foil are deformed by heat during pressing, and the deformation depends on the coefficient of thermal expansion (CTE) of the two materials;

2017/11/20

Installation of accessories for vacuum laminator

Installation of accessories for vacuum laminator

In the vacuum laminator assembly, an accessory is called a buffer pad. The buffer pad is sandwiched between the hot pressing plate and the template. Its main function is to uniformly transmit the working pressure and working temperature of the hot pressing plate, which can make the paper veneer and the substrate The adhesion between the boards is more dense, uniform and smooth, thereby improving the surface and internal quality of the veneer.

2017/11/20

Brief Introduction of German LAUFFER Laminating Machine

Brief Introduction of German LAUFFER Laminating Machine

German LAUFFER laminator history has more than 80 years. Founded in 1872, LAUFFER PRESSEN has customers around the world and is used in many fields. From the beginning to the end, the quality is reliable.

2017/11/20

Maintenance of Vacuum Laminator

Maintenance of Vacuum Laminator

The damage form of the pressure plate of the vacuum laminator is mainly the wing curvature and local groove marks at the edge, so that the pressure and heat transferred from the pressure plate to the product are not balanced, and the fiberboard will be partially carbonized, partially soft or sticky, and the product cannot meet the quality standard requirements.

2017/11/20

Analysis of Warpage and Distortion of PCB in Laminator Production

Analysis of Warpage and Distortion of PCB in Laminator Production

Phenomenon: Whether before, after or during processing, the substrate is warped or distorted. Post-soldering hole tilt is also a sign of substrate warpage and distortion.

2017/11/20

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